Silicone two components encapsulating glue for module

Product Introduction
Ausbond 190 series is a kind of multi-component comprehensive organic silicon injection material, which can be cured at normal temperature; the ethanol molecules released in the process of cure won't erode the materials of PC (Poly-carbonate), ABS, PVC and copper wire.It owns excellent adhesive force for most of the materials of electronic parts (except PP and PE).Group A is divided into glue material; group B is divided into cure agent; group is divided into extinction powder.

Product Features
1. It has good adhesive and fluid, which can be pored into the slightest place.
2. It shrinks seldom in the process of cure with good excellent performance of waterproof and anti-moisture.
3. It is more convenient to operate and use with the performance of room temperature and
self-drainage bubble.
4. It owns good performance of anti-shock,resistance, anti-aging and lasting adhesive force and it can keep the elasticity of rubber within the range of -60--200 degrere celsius; The insulation is good.

Typical Purposes
It is widely used in high power electronic components, module power, circuit board and
protection of LED injection.

Package Specification
22kg/suite (group A 20kg+group B 2kg);

Storage and Transport
1. Store in the cool and dry place, with shelf life 6 months (25℃).
2. This product belongs to non-dangerous articles;please transport it as general articles.