Professional Round PCB Turnkey PCB Assembly for Digital Photo Frame

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Professional Round PCB Turnkey PCB Assembly for Digital Photo Frame
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Specifications

1. ?High quality,reasonable price?
2. ?No MOQ rules?
3. ?Fast delivery time?
4. OEM and ODM orders welcomed?

Digital Photo Frame PCBA
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1.Material:FR4 ,CEM1,CEM3 ECT
2.Layer:?8 layers
3.Board Thickness: 1.6mm
4.Copper Thickness:1 OZ
5.Min. Line Width: 0.5mm
6.Min. space :0.5mm
7.Solder mask color :Green, Red, White, Yellow, Black, Blue
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Quotation Requirement :
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Following specifications are needed for quotation:
1) Base material:
2) Board thickness:
3) Copper thickness:
4) Surface treatment:
5) Color of solder mask and silkscreen:
6) Quantity
7) Gerber file &BOM
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PCB?capability?and?services:?

1.?Single-sided,?double-sided?&?multi-layer?PCB?(up?to?30?layers)
2.?Flexible?PCB?(up?to?10?layers)
3.?Rigid-flex?PCB?(up?to?8?layers)?
4.?CEM-1,?CEM-3?FR-4,?FR-4?High?TG,?Polyimide,?Aluminum-based?material.?
5.?HAL,?HAL?lead?free,?Immersion?Gold/?Silver/Tin,?Hard?Gold,?OSP?surface?treatment.?
6.?Printed?Circuit?Boards?are?94V0?compliant,?and?adhere?to?IPC610?Class?2?international?PCB?standard.?
7.?Quantities?range?from?prototype?to?volume?production.?
8.?100%?E-Test?
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Detailed?Specification?of?PCB?Manufacturing
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PCB?Assembly?services:?
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SMT?Assembly?

Automatic?Pick?&?Place?
Component?Placement?as?Small?as?0201?
Fine?Pitch?QEP?-?BGA?
Automatic?Optical?Inspection?
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Through-hole?Assembly?

Wave?Soldering?
Hand?Assembly?and?Soldering?
Material?Sourcing?
IC?pre-programming?/?Burning?on-line?
Function?testing?as?requested?
Aging?test?for?LED?and?Power?boards
Complete?unit?assembly?(which?including?plastics,?metal?box,?Coil,?cable?assembly?etc)?
Packing?design
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Conformal?coating

Both?dip-coating?and?vertical?spray?coating?is?available.?Protecting?non-conductive?dielectric?layer?that?is?
applied?onto?the?printed?circuit?board?assembly?to?protect?the?electronic?assembly?from?damage?due?to?
contamination,?salt?spray,?moisture,?fungus,?dust?and?corrosion?caused?by?harsh?or?extreme?environments.
?When?coated,?it?is?clearly?visible?as?a?clear?and?shiny?material.

Complete?box?build

Complete?\'Box?Build\'?solutions?including?materials?management?of?all?components,?electromechanical?parts,?
plastics,?casings?and?print?&?packaging?material
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Testing?Methods

AOI?Testing
·Checks?for?solder?paste?
·Checks?for?components?down?to?0201\"?
·Checks?for?missing?components,?offset,?incorrect?parts,?polarity
X-Ray?Inspection
X-Ray?provides?high-resolution?inspection?of:?
·BGA