Dust Proof Copper Foil Printed Circuits Board Flexible For Mobile Phone

Brand Name	Customization (OEM/ODM)		Place of Origin	China
Model Number	HC-FPC-1-003

Delivery Time:Within 3 weeks based on MOQ
Certification:ISO9001:2008,

Dust Proof Copper Foil Printed Circuits Board Flexible For Mobile Phone
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Material: PI: 1 milCu: 1 ozPI: 1 milSurface treatment: pure-tin platingMinimum hole dimension: 0.3mmMinimum linear width: 0.08mmMinimum linear distance: 0.08mmExternal tolerance:0.05mmWelding resistance: 280 more than 10 secondsPeeling Strength: 1.2kg/cm2Heat resistance: -200 to +300 degrees CSurface resistivity: 1.0 x 1011Bandability: meet IPC standardChemical resistance: meet IPC standard

1. Flexibility
It can be bent, folded and deformed freely. Its coil radius is small and it can be moved freely along X, Y, Z axis separately.
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2. Occupy small space
Since it is light and thin, it makes best use of the narrow space in the instruments. (average thickness 1.1-0. Am)
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3. Light weight
Its weight is very light because the design of FPC is not based on mechanical strength but current load.
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4. Good seal capability
The flexible board could be designed for low- tensile seal enduring the adverse environment.
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5. Steady transmission
The wiring pattern and the conductor distance can be freely designed according to electric parameters. Once the pattern is finalized, parameters of R. L. C is steady accordingly.
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6. Easy assembly
The property of terminal is good enough to be fixed to any equipment by soldering, inserting, riveting and gluing. Manual mistakes in traditional wiring are avoided.
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7. Good insulation
We selected the materials with good insulation property, such as polyimide, polyester, etc. Usually, the wiring is covered, so the insulation is greatly strengthened.
FPC & FFC can be extensively applied:
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Description:
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Copper foil substrate (Copper Film) [3]
Copper foil: basically divided into two kinds of electrolytic copper and rolled copper common thickness 1oz 1/2oz and 1/3 oz
Substrate film: a common thickness of the 1mil with 1/2mil two kinds.
Glue (adhesive): thickness according to customer requirements.
Cover film protection film (Cover Film)
Cover film protection film: surface insulation. The common thickness 1mil with 1/2mil.
Glue (adhesive): thickness according to customer requirements.
Adhesive buildup of foreign matter before pressing the shape from the paper: avoid; easy job.
Stiffener (PI Stiffener Film)
Stiffener: reinforcing the mechanical strength of the FPC, to facilitate the surface mounting job. Common thickness 3mil to 9mil.
Glue (adhesive): thickness according to customer requirements.
Shape from the paper: to avoid foreign matter adhesive buildup Crimping before the.
EMI: electromagnetic shielding film, the protection circuit board line without interference from the outside world (a strong electromagnetic District or susceptible to interference zone).
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Applications:
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1.The mobile phone
Focuses on the flexible circuit board light weight and thin thickness. Can effectively save the volume of products, easy connection of the battery, microphone, and buttons and into one.
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2.Computer and LCD screen
Use the one line configuration of flexible circuit boards, and thin thickness. The digital signal into the picture, through the LCD screen
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3.CD player
Focuses on three dimensional assembly characteristics of flexible circuit boards and thin thickness. The huge CD to carry around
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4.Disk drives
Regardless of the hard disk, or diskette, is very dependent on FPC high softness and thickness of the 0.1 mm slim, read data finish quickly. Either a PC or NOTEBOOK.
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5.The latest applications
Hard disk drives (HDDS, hard disk drive) of suspended circuit (Su ensi. N cireuit) and the components of xe packaging board, etc
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Specifications:
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As per request OEM/OEM
Material: PI: 1 mil
Cu: 1 oz
PI: 1 mil
Surface treatment: pure-tin plating
Minimum hole dimension: 0.3mm
Minimum linear width: 0.08mm
Minimum linear distance: 0.08mm
External tolerance:0.05mm
Welding resistance: 280 more than 10 seconds
Peeling Strength: 1.2kg/cm2
Heat resistance: -200 to +300 degrees C
Surface resistivity: 1.0 x 1011
Bandability: meet IPC standard
Chemical resistance: meet IPC standard
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Competitive Advantage:
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1.short: assemble shorter working hours
All lines in the configuration is complete. Save extra FPC PCB FPC PCB wiring connection work
2. Small: small volume PCB
Can effectively reduce the products volume. The increase is to carry on the convenience
3. Light: weight lighter than PCB (hard)
Can reduce the weight of the final product
4.Thin: thinner than the thickness of hard PCB board.
Can improve the softness. Strengthen then limited space for three dimensional assembly
5.quick delivery
6.best services
7.OEM /ODM available.
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