ARLON CEM-3 8 layer FR4 Multilayer High Speed High-tg PCB Rigid 1.6mm

PRODUCT’S DETAILS

Raw Material

FR-4 (Tg 180 available)

Layer Count

6-Layer

Board Thickness

1.6mm

Copper Thickness

2.0oz

Surface Finish

ENIG(Electroless Nickel Immersion Gold)

Solder Mask

Green

Silkscreen

White

Min. Trace Width/Spacing

0.075/0.075mm

Min. Hole Size

0.25mm

Hole Wall Copper Thickness

≥20μm

Measurement

300×400mm

Packaging

Inner: Vacuum-packed in soft plastic bales

Outer: Cardboard Cartons with double straps

Application

Communication,automobile,cell,computer,medical

Advantage

Competitive Price,Fast Delivery,OEM&ODM,Free Samples,

Special Requirements

Buried And Blind Via, Impedance Control, Via Plug,

BGA Soldering And Gold Finger Are Acceptable

Certification

UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE

PRODUCTION CAPABILITY OF PCB

PROCESS Engineer

ITEMS Item

????????? PRODUCTION CAPABILITY Manufacturing Capability

Laminate

Type

FR-1,FR-5,FR-4 High-Tg,ROGERS,ISOLA,ITEQ,

ALUMINUM,CEM-1,CEM-3,TACONIC,ARLON,TEFLON

Thickness

0.2～3.2mm

Production Type

??? Layer Count

2L-16L

Surface Treatment

?HAL,Gold Plating,Immersion Gold,OSP,Immersion Silver,Immersion Tin,Lead Free HAL

?Cut Lamination

Max. Working Panel size

?1000×1200mm

?Inner Layer

?Internal Core Thickness

0.1～2.0mm

?Internal width/spacing

Min: 4/4mil

?Internal Copper Thickness

1.0~3.0oz

?Dimension

Board Thickness Tolerance

±10%

?Interlayer Alignment

±3mil

Drilling

?Manufacture Panel Size

Max: 650×560mm

?Drilling Diameter

≧0.25mm

?Hole Diameter Tolerance

±0.05mm

?Hole Position Tolerance

±0.076mm

?Min.Annular Ring

0.05mm

PTH+Panel Plating

?Hole Wall copper Thickness

≧20um

?Uniformity

≧90%

?Outer Layer

?Track Width

Min: 0.08mm

Track Spacing

Min: 0.08mm

?Pattern Plating

?Finished Copper Thickness

1oz～3oz