Multi Layer DIP CSP Printed Circuit Board AssembliesFor MP4 0.3 mm Thickness

Key Specifications/Special Features

1

We SYF have 6 PCB production lines and 4 advanced SMT lines with high speed.

2

All kinds of integrated circuits are accepted,such as SO, SOP, SOJ, TSOP, TSSOP, ?QFP, DIP, CSP,BGA and U-BGA , Because Our placement precision can reach chip +0.1mm on integrated circuit parts.

3

We SYF can provide service of 0201 chip placement, through-hole components insertion and finished products fabrication, testing and packaging.

4

SMT/SMD assembly and through-hole components insertion

5

IC preprogramming

6

Function verification and burn in testing

7

Complete unit assembly (which including plastics, metal box, coil, cable inside and more)

8

Environmental coating

9

Engineering including end of life components, obsolete component replace and design support for circuit, metal and plastic enclosure

10

Packaging design and production of customized PCBA

11

100% quality assurance

12

High mixed, low volume order is also welcomed.

13

Full component procurement or the substitute components sourcing

14

UL,ISO9001:2008, ROSH ,REACH,SGS,HALOGEN-FREE compliant

PRODUCTION CAPABILITY OF PCB ASSEMBLY

Stencil Size Range

?756 mm x 756 mm

Min. IC Pitch

?0.30 mm

Max. PCB Size

?560 mm x 650 mm

Min. PCB Thickness

?0.30 mm

Min. Chip Size

?0201 (0.6 mm X 0.3 mm)

Max. BGA Size

?74 mm X 74 mm

BGA Ball Pitch

?1.00 mm (Min) / F3.00 mm (Max)

BGA Ball Diameter

?0.40 mm (Min) /F1.00 mm (Max)

QFP Lead Pitch

?0.38 mm (Min) /F2.54 mm (Max)

Frequency of Stencil Cleaning

?1 time / 5 ~ 10 Pieces

Type of Assembly

?SMT and Thru-hole

Solder Type

?Water Soluble Solder Paste,Leaded and Lead-free

Type of Service

?Turn-key,Partial Turn-key or consignment

File Formats

?Bill of Materials(BOM)

?Gerber Files

?Pick-N-Places(XYRS)

Components

?Passive Down to 0201 Size

?BGA and VF BGA

?Leadless Chip Carr