Rigid PCB Printed Circuit Board Fabrication and Assembly , 1~26 Layers

Layers

Mass production: 1~26 layers

Max. Thickness

Mass production: 4.0mm

Material

FR-4 (Standard FR4, Medium Tg FR4,High Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic filled , Teflon, Polyimide, BT, Hybrid, Rogers etc.

Min. Width/Spacing

Inner layer: 3mil/3mil (0.5oz), Outer layer: 4mil/4mil(1oz)

Max. Copper Thickness

6.0 oz

Min. Hole Size

Mechanical drill: 8mil? Laser drill: 3mil

Max. Panel Size

600mm × 700mm

Aspect Ratio

12:1

Surface Finish

HASL, Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger

Special Process

Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control.

SMT

Position accuracy: 20 um

Components size: 0804,0603,0402,Flip-CHIP,QFP,BGA,POP

Max. component height:25mm

Max. PCB size:580×600mm

Min. PCB size: no limited

PCB thickness:0.3 to 6mm

Wave-Solder

Max. PCB width:450mm

Min. PCB width: no limited

Component height: Top 120mm/ Bot 15mm

Sweat-Solder

?Metal type :part, whole, inlay, sidestep

?Metal material: Copper , Aluminum

?Surface Finish: plating Au, plating sliver , plating Sn

?Air bladder rate: less than20%

?Press-fit

?Press range:0-50KN

?Max. PCB size:800X600mm

?Testing

?ICT, Probe flying, burn-in, function test, temperature cycling