Home > Products > BGA red glue > 360g Best-seller Red Glue for PCB/ SMD Red Glue
360g Best-seller Red Glue for PCB/ SMD Red Glue
- T/T L/C D/P D/A
- 7 days
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Product Details
Brand Name | Seal | Place of Origin | China | |
Product Description
Best-seller BGA Red Glue for PCB/ SMD Red Glue
Specifications
New item & best seller red glue
1) 100% super glue
2)Fast shipping
3) lower price
Fuji red plastic, produced in Japan, is used in the field of SMT as a stable single-component epoxy adhesive, the product main models are: Fuji red plastic NE3000S; Fuji red rubber 8800K; Fuji red rubber 8800T.
Feature
1, to allow low-temperature hardening;
2, despite the high-speed coating, micro-small amount of coating can be maintained without any drawing, the collapse of the stable shape;
3, for a variety of adhesive components that are available to the stability of the adhesion strength;
4 stores stability and excellent performance;
5, with high heat resistance and excellent electrical properties;
6, can also be used for printing.
7, the higher the curing temperature and curing time longer, more access to a high degree of intensity;
8, depending on the size of the parts containing the substrate, and filled with different positions, in addition to the actual adhesive temperature varies, so need to find the most suitable curing conditions.
Curing condition
Fuji Red glue curing condition other models red rubber NE3000S: recommended curing conditions are the substrate surface temperature reaches 150 °C after 60 seconds or after 100 seconds to reach 120 °C; Fuji red rubber 8800K: recommended curing conditions are the substrate surface temperature reaches 150 °C after 60 seconds to reach 120 °C after 100 seconds; Fuji red rubber 8800T: recommended curing conditions are the substrate surface temperature reaches 150 °C after 45 seconds, reach 120 °C after 100 seconds;
Caution
1, for the adhesive properties most effective, be sure to place the refrigerator (2 °C ~ 10 °C) preservation;
2, removed from the refrigerator to use when the temperature until the adhesive fully restored to room temperature before use;
3, if hose at the point of dispensing by adding the amount of the plunger can be more stable;
4, because the relationship to prevent drawing the most suitable dispensing set temperature is 30 °C ~ 38 °C;
5, fill in the hose from the cylinder, the Please use the private automatic filling machine, in order to prevent infiltration of air bubbles;
6, for the point of washing hose using DBE or ethyl acetate.
More products please login below company websites:
MINGDA Technology Co.,Ltd
Ms .Doris zhang sales manager
Tel:0086-0755- 83360136
0086-0755-13500068891
Fax:0086-0755-82736291
Skyp: mdanti-static
MSN : md-99@163.com
Email: md-99@163.com
Contact Us
- Mingda Technology CO., LTD
- Contact nameSam Zhang Chat Now
- Phone86-755-82736291
- Address, Binzhou, Shandong
Product Categories
BGA Paste Flux | BGA Reball kit and BGA Stencil | BGA red glue | BGA rework station |
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