2016 Shuttle Star Die-bonding VCSEL/PD Platform ic mounter with Micron accuracy more than ir6000 bga rework station

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Product Details

Condition	New	Place of Origin	Guangdong, China
Brand Name	Sostar	Model Number	M5
Dimensions	140100210mm	Weight	100-200kgs
Usage	LD BAR	Certification	CE Certification
After-sales Service Provided	Engineers available to service machinery overseas

2016 Shuttle Star Die-bonding VCSEL/PD Platform ic mounter with Micron accuracy more than ir6000 bga rework station

M5 is a multifunctional micro assembly machine, better than 5μm 3σ alignment accuracy.

It can be integrated with Eutectic Die Bonding Module, Bonding Force Module,

Dispenser Module,UV Curing Module, Process Observing Module, Ultrasonic Bonding Module

to reach different customers’ requirement.

It is mainly used for assembly medical CT Detector, Fiber-optic communication VCSEL/PD/LENS,LD Bar,RFID and MEMS/MOEMS Sensor field etc

Feature:

Placement Accuracy:±2.5μm 3σ

Working Area:X: 340mm, Y:150mm, Z:20mm

Bonding Force:0.1N~200N

Heating Temperature:25℃~400℃

Component Size: 0.1mm~40mm

Application Field:

Die-bondig for all nm size component

Shenzhen Shuttle Star Industrial Co., Ltd.: Contact nameLilly Lee
Chat Now; Phone86-755-27513884; Address10F.Beifang Junyi Industrial Park,Xingwei Crossing,Fuyong district,Bao An,Shenzhen, Shenzhen, Guangdong

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