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Pcb Assembly Circuit Electronics,printed Circuit,electronics Circuit
- Shenzhen or Hongkong
- T/T D/P D/A
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Product Details
| Brand Name | HENGTAITO | Model Number | HKT836 | |
| Number of Layers | 4-Layer | Base Material | FR4 | |
| Copper Thickness | 0.5oz-3oz | Board Thickness | 0.4mm-3.2mm | |
| Min. Hole Size | Machine Drilling 0.2mm; Laser Drilling 0.1mm | Min. Line Width | 3mil | |
| Min. Line Spacing | 3mil | Surface Finishing | HASL,ENIG, ENTEK (OSP) |
Product Description
Specifications
1. One-stop service over 10 years2. UL, RoHS, ISO14000 approved
3. Precision:01005,0201,0402,0603,0805,1206,1608,2125
Welcome to HENGKAITUO(DAYEE)
What we can do for you?
EMS-Electronic Manufacturing Service
PCB Supply and Layout
PCB Assembly on SMT, BGA and DIP
Cost Effective Components Sourcing
Fast Turn Prototype and Mass Production
Box Build Assembly
Engineering Support
Tests(X-ray, 3D Paste Thickness, ICT, AOI and Functional tests)
Logistics and After-sales Service
Manufacturing capability
PCB Layers | 1 Layers to 12 layer (standard) |
Material | FR4, Aluminum, CEM1 |
Solder mask | green, black, white, red, blue |
Copper thickness | 0.5um-4um |
Surface finish | HASL,ENIG,OSP |
Min holes | 0.2mm by machine; 0.1mm by Laser Drilling |
Min track width | 3mil |
PCB Dimension | 600x1200mm |
IC Pitch(min) | 0.2mm |
Chip Size(min) | 0201 |
BGA Size | 8x6mm~55x55mm |
| SMT Efficiency | SOP/SSOP/PLCC/QFP/QFN/BGA/FBGA/u-BGA |
u-BGA ball dia. | 0.2mm |
Required Docs for PCBA | Gerber file with BOM list & Pick-N-Place File(XYRS) |
Why us?
*- Get a high quality product: AOI X-ray test & 4 times 100% QC inspection before Shipping
*- Get a lower price of product to occupy the market.
*- Our one stop service release your energy to focus on design and marketing.
*- Get a strategic long term partner.
So, you must win!
Our Products
Contact Us
- Shenzhen Hengkaituo Sci-Tech Co., Ltd.
- Contact nameJane Ma Chat Now
- Phone0086-755-28548369
- Address37 B, B zone, Fulian, Longhua district, Shenzhen, Guangdong
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