Full-automatic H80 3D Solder Paste Thickness Tester With PCB Mark SMT Equipment

Specifications

                         H80 3D Solder Paste Thickness Tester

Features

1. the maximum measuring range,330mm*300mm (530mm *460mm), fully meet the requirements of the substrate;

2. Automatic plywood, quick positioning, without manual adjustment, can be described as easier to operate, truly programmable test system;

3. looking through the PCB MARK automatically check and correct the offset position;

4. A 3-axis automatic movement, auto focus, automatic compensation correction substrate warpage, solders paste height to obtain accurate figures;

5. High-speed Japanese COOL MUSCLE integrated servo system, high speed, high precision and powerful SPC statistical analysis software;

6. can coordinate when the SMT machine use, early warning, can automatically generate CP, CPK, X-BAR, R-CHART, SIGMA column, Trends, control charts, etc.;

7. the scanned image can be sliced cross-section measurement and analysis, when using 2D solder paste thickness tester;

8. Precise and reliable hardware system to provide credible and reliable service life test accuracy;

9. The thicknesses of the test beyond the multi-function test solder paste;

10. A list of measurement data is automatically saved to generate SPC reports for easy viewing;

Others

• IC package, PCB space deformation measurement;
• steel mesh hole size and shape measurements;
• PCB pad, screen thickness and shape of the measurement pattern;
• to provide squeegee pressure prediction, the printing process optimization;
• chip state Set, part of flatness, BGA / CSP size and shape measurement equipment;

 Technical Parameters

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