Home > Products > main manual and auto bga repair machine > 2016BGA alignment system BGA chip removal machine for laptop TV motherboard
2016BGA alignment system BGA chip removal machine for laptop TV motherboard
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Product Details
Place of Origin | Guangdong, China | Brand Name | wisdomshow BGA chip removal machine | |
Model Number | WDS-650 BGA chip removal machine | Voltage | 220V | |
Current | Dependable | Rated Capacity | 5500W | |
Rated Duty Cycle | 100% | Dimensions | L880*W880*H720mm | |
Weight | 85kg | Usage | repair all different motherboard bga chips | |
Certification | CE ISO certification |
Product Description
2016BGA alignment system BGA chip removal machine for laptop TV motherboard
skype: ivyzhou90
what's app:+8613825209905
Tel:+86075527336219
Where WDS-650 can be used ?
It is capable of repairing various type on component like BGA,QFP,IC,QFN, PLCC etc on motherboards, mobile phones,PSP,Xbox and many other electronics circuit boards.
Desolder ,remove, clean, reball, mount, solder BGA Chips, FBGA, QFP etc. SMT chips.Laptop,desktop computer,xbox360,psp,ps2 and mobile BGA Chip, such as CPU, GPU, south bridge, north bridge etc.Also apply to Lead free BGA Chip Rework.
Repair success rate is up to 99.9%.Also,good quality BGA reballing accessories like BGA reballing station.BGA solder ball,BGA stencils and laptop repair accessories are provided. BGA chip removal machine
What is the parameter BGA chip removal machine?
1 | total power | 5500W |
2 | Upper heating power | 1200W |
3 | Lower heating power | Second temperature zone 1200W,Third temperature zone2700W |
4 | Power supply | (Single Phase)AC 220V±10 50Hz±3 5.2KVA |
5 | Overall dimension | L880*W880*H720mm
|
6 | Locating way | V-shaped groove,PCB holder can adjust any direction of X,Y Laser position |
7 | Temperature controlling | (high precision K-sensor)(Closed Loop),UP and down can test the temperature independently |
8 | Large PCB size | 580×460mm |
9 | Small PCB size | 10×10mm |
10 | Chip zoom multiple | 2-50 multiple |
11 | Weight of machine | 85kg |
What is WDS-650 specification BGA chip removal machine?
1.The upper heating head and placement head are design 2 in 1, which have automatic welding and automatic placement function ,connect with laptop bga rework stationusing the touch screen,HMI,PLC control,which can show you the three temperature curves anytime and the temperature control can accurate to +1Celsius degree.8 Paragraph temperature control, which can be set to warm up, insulation, heating, soldering1, soldering 2,cooling.The excellent temperature control system can ensure the best soldering effect. BGA chip removal machine
2.Total have 3 temperature zones to heating independent, the first and second temperature zones can control many groups and paragraphs temperatures at the same time, the third temperature zone can preheating a large areas of the PCB board, and make the best soldering effect .
3.The second zone designs specially to support the PCB board, which can go up and down, prevent the PCB board collapse from the damage during soldering.
4.Select the high precision K-type thermocouple closed-loop control, the temperature measurement interface in outside can achieve precise temperature detection.
5.Store more than 100 temperature cure setting, change the setting and analysis the curve at any time.
6.Using the V-shaped groove to position the PCB board, removable universal jigs can protect the PCB board. Automatic BGA Rework Station
7.Using the high power crossflow fan to cooling the PCB board in a short time,protect the PCB board and ensure the soldering effect.
8.With the alarm function, after the BGAwelding the machine can alarm by itself. In the case of temperature abuse, the circuit can power off automatically with the double over-temperature protection.
9.Touch screen control of the upper heating system and optical digital device,easyto operate and ensure alignment precision control within 0.01-0.02mm.
10.Using the highprecision optical alignmentvideo system with spectral amplification, fine-tuning function,with 15” color LCD monitor.High automatic,can avoid the human operating errors and have excellent special effect on lead-free technology as well as the pop package devices. BGA Resoldering Machine
Wooden package or other ways according to your requirement
Shipping: DHL,FEDEX,TNT,UPS,BY AIR OR BY SEA,it's depend on you.
***Normally ,it takes about 3 working days to USA and 4 working days to European countries.and more than 3 days for slow expresses ,we can ship as ur request and help to find the most cost-efficient and fast ways.
Once upon delivery ,we will send ur tracking number immediately.***
Engineers available to service machinery overseas
1.Professional factory manufacturing bga rework station,best production capability,best quality control,best service.
2.CE,Offer most competitive price.
3.100% QC inspection before shipment.
4.Speedy and high quality customer service and after-sale service possible.
5.Deliver goods to customer all over the world with speed and precision.
Do you mind if I still have some questions:
Q1:What’s our payment terms?
1,T/T :30% deposit, Balance before shipment;
2,Western Union;
3,Paypal;
4,L/C
Q2:What’s our delivery time?
within 3 days after the payment.
Q3:What's our Product application?
1. Laptop notebook motherboard bga rework and repair;
2. Game consoles applications such as xbox Ps3 Wii bga rework and repair;
3.Large circuit board maintenance, and mobile phone motherboard such small small-sized chip.
Q4:What’s about training and warranty?
Life-time free training of operation and maintenance.
Warranty:lifetime free service ,3 years warranty. the 1st year is free, ONLY spare parts charged after the 1st year.
Reply within 24hours,7 days/week.
Training and warranty can be from the overseas local office or Shenzhen Wisdomshow office directly.
Welcome to join us,thanks for ur kind attention !
Contact Us
- Shenzhen Wisdomshow Technology Co., Ltd.
- Contact nameIvy Zhou Chat Now
- Phone86-0755-27336219
- AddressNo.6 Haosi Western Industrial Park,Shajing Town,Bao'an District,Shenzhen,China, Shenzhen, Guangdong
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