HY710 CPU Silicon heat dissipation Compound Paste grease

HY710 CPU Silicon heat dissipation Compound Paste grease 

Features

• 1: Tends to form a thinner layer between CPU and heatsink than other greases even under low pressure
• 2: 3.17W/mK Ultra-High thermal conductivity for superior heat transfer Best solution for the heatpipe direct contact or heatpipe direct touch type CPU cooler. (Ex: Sunbeam Core Contact Freezer)
• 3: Helps the low-pressure clip design of cooler to achieve better cooling performance

Specification :

Silver thermal grease,the thermal conductivity is 1.93W/m-K~3.8W/m-k

* The Dielectric constant is very high, can withstand voltages above 10 000 volts.

*Low thermal impedance, it can endure paste state.

*Wide Operation temperature range, can keep stable performance between -55~300°C.

*High heat dissipation performance, have effective cost .

Overview:

HY700 is the highest performing thermal compound in the industry, bar-none!   Both non-toxic and nonconductive, the ultra small molecular structure of HY700 enables the thinnest 

possible layer of thermal compound application while filling all the gaps between the cooler and 

the CPU for extreme thermal conductivity. 

If you are looking for the ultimate thermal compound, look no further, the HY700 is the only 

choice for you, dont take our words for it, try it and find out for your self!

From the thinnest possible application to the highest thermal conductivity,

 HY700 is the perfect medium between your heat producer and your heat sink.

Contact us now !