HJZ-DISPENSER-6600 High speed jetting glue dispensing bezel glue dispensing machine

Shenzhen Heng Jin ZhiTechnology Co., Ltd. based in Shenzhen & established in 2014,and specialized in automatic soldering equipment, automatic locking screw equipment, automated dispensing equipment, labeling machines, laser machines, ACF machines, automated assembly line,other high-tech enterprise automation control equipment,standardizedmachines,non-standard machines and related product development, production, sales and import and export.We provided high-speed, high-precision fully automated technology programs with high reliability and flexibility to our customers mainly in the telecommunications, semiconductor, plastic modules, automotive electronics, new energy and other areas. Currently, our products are mainly exported to Europe, America, Southeast Asia and other markets, the main customers include Oticon, Electrolux. Bosch, Flextronics, Foxconn, Panasonic, Philips, Huawei, ZTE and so on. Heng Jin Zhi Technology Co., Ltd. has accumulated years of technology industry experience, adhere to the people-oriented, innovative development concept, to provide 24-hour service to support customer demand, professional engineers to help customers complete the installation, commissioning, training and process improvement. We look forward to providing professional solutions for automated production processes and agents to join us in the global market. Our vision: to become a global manufacturer and marketer of leading automation products. Our mission: to create value for customers.

2. Product Specifications

1. The field of application of non-contact jet valve, Z axis without lifting, thereby widening the broader
2. mature and stable high-speed, high-precision motion platform
3. The automatic thermostat to ensure a consistent flow of paint
4. equipped with high-precision weighing system, ensuring consistent glue, reduce material waste, improve productivity and yield
5. The on-line delivery system can communicate with other devices
6. precise positioning and automatic visual visual sampling system
7. Automatic altimeter system, the substrate warpage no effect
8. Windows control software interface is simple, easy programming
9. optionally equipped with injection valves, screw valves and pneumatic valves
10. The modular design can be equipped with an optional arbitrary function item
11. The high-speed jet, the maximum 200 points per second
12. The size can be arbitrarily set point can achieve a smaller diameter dispensing
13. A vacuum cleaner nozzle means

3. Product Feature

1. 0 ~ 7Bar low-voltage operation
2. supplies less affordable
3. minimum injection quantity 0.002 microliters
4. Non-contact, needle-free design
5. maximum injection rate of 3000 times / sec.
6. High accuracy (within 1% by volume)
7. Piezo drives, software correction
8. nozzle may heat, and the temperature distribution
9. using quick release nozzle design, electronic adjustment
10. 1 ~ 2,000,000mPas wide applicability viscosity
By Industry:
11. communications industry: hot-melt adhesives, UV glue, conductive silver paste
12. optical communications industry: silica gel, micro-optical glue dispensing, packaging and other applications
13. biomedicine industry: Biotechnology spermatogonia transport, protein ratio, etc.
14. LED manufacturing: phosphor dispensing, filling potting, LED flexible strip packaging applications
15. Electronics Industry: SMT, PCB board, LCD, components, housings, insulators, etc.

 4.Suitable liquid

Various solvents, adhesives, paints, chemicals, glue, etc., including silica gel, EMI Conductive plastic, UV glue, AB Glue, fast rubber, epoxy glue, sealant, hot glue, grease, silver plastic, red plastic, solder paste, thermal grease, solder Paste, lacquer, screw fixation agent, wood glue, anaerobic adhesive, acrylic adhesive, wear rubber, Crystal, potting compound, Horn glue, instant glue, rubber, paint, enamel paint, lacquer, ink, pigments, etc.

6. Applications

• Underfill
• FPC package
• SMT red plastic dot
• Silver Point
• Solder Paste
• LED package
• component package
• Surface Mount
• Precision coating
• a semiconductor chip package

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