Epoxy resin AB glue Dedicated to electronics potting, power encapsulation, mold filling and other electronic components .

Product Name: low hardness electronic potting glue
Model: 858 AB
Product Features: This product is environmentally friendly rigid epoxy glue at room temperature or heat curing, medium viscosity, black, no bubbles, strong adhesion, good leveling, curing low hardness, smooth surface, shiny, waterproof insulation;
Usage: dedicated to potting, insulation, moisture potting power switches, adapters, be safe and other electronic parts, confidential cover seal.
Technical Parameters:
Appearance and physical properties:

Ratio: A: B = 100: 20 (weight ratio)
You can use time: 25 ℃ × 60 mins (100g mixed volume)
Curing condition: room temperature for 8-10 hours or 60 ℃ × 1 hour.

1. To potting products need to be kept dry and clean;
2. Please check with an A agent, to observe whether there settlement, and A agent, stir;
3. Press the ratio for quantity, and the weighing accuracy, please remember that the ratio is the weight rather than volume, A, B agent need stir mixed, to avoid incomplete cure;
4. Stir timely manner to Glue, and try to end the use of glue has been mixed within the available time;
5. After perfusion glue will gradually penetrate into the gaps of the product, if necessary secondary Glue;
6. curing process, please keep the environment clean and avoid impurities or dust falling into the uncured glue surface.