wafer biscuit making machine

wafer biscuit making machine

This wafer biscuit line can make many kinds of wafer, the wafer with your requested sizes and also with chocolate coating

Adopting hearing-medium conduction technology with heating oil as medium, the plant is a new generation product developed exclusively in China based on the advanced structure of existing plants from domestic market and abroad. If offers an ideal solution for lower power consumption and overall production  cost, and keeping the same surface color for all biscuits. The plant mainly consists of mixing system, automatic feeding system, tunnel-type oven, sheet feeding and cooling device, coating machine, cutter and organic heating medium boiler, ect. With compact structure and unique reliability, the plant is one of the most preferred equipments in foodstuff industry.

The wafer baking system uses LPG for heating of the baking plates. It is controlled by a PLC made by TAIWAN brand. The functions of the baking oven are fully automatic from spreading batter on the plates to the procedure of baked wafer sheets coming out of the oven. Baking is even and produces good quality wafer sheets for next procedure. In PLC there is a PID controller which is used to control the temperature of the baking plates automatically .The collection of required signal of PID is supplied by infrared sensor which is produced by RAYTEK of U.S.A .The oven status display and the data reset are supplied by TAIWAN brand. Contactor switch is supplied by SCHENEIDER Company in China. The stepping wheel bearings of the mould rack are SKF special designed for wafer baking oven. The pneumatic components are supplied by TAIWAN. The main drive will be SEW Euro drive of German brand. There is an automatic spurring-cleaned device at the bottom of the baking oven. There is a second pressure relief valve. The plating is specially used to produce the wafer of special recipe, which can protect wafer from pollution and cauterization.

Main technical parameter:

Total quantity of Gas heated Baking Plates:  27pairs.

Door-type Wafer Sheet Cooler

This machine raises the wafer sheets to have natural cooling. This machine relieves heat stress applied on the wafer sheet during baking process. Unless the sheets are cooled smoothly, it tends to break even for a small impact during further processing of the wafers due to heat stress. This machine also called stress-reliving machine. This is an improved system according to your requirement increasing width & height of the carry arms. The part which may contact to the food is made of stainless steel.

This machine is used to collect the wafer sheet. Power:  0. 18Kw,380v/3Phase /50Hz Air consumption: 0.05m³/min/0.8Mpa Pressure 

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