Wafer Baking Oven

Specifications

 Wafer Baking Oven

Introduction:

The baking oven is very important equipment in the wafer production line. The wafer baking system uses LPG for heating of the baking plates. It is controlled by a PLC made by MITSUBISHI brand. The functions of the baking oven are fully automatic from spreading batter on the plates to the procedure of baked wafer sheets coming out of the oven. Baking is even and produces good quality wafer sheets for next procedure. In PLC there is a PID controller which is used to control the temperature of the baking plates automatically .The collection of required signal of PID is supplied by infrared sensor which is produced by RAYTEK of U.S.A .The oven status display and the data reset are supplied by HAKKO by Japan. Contactor switch is supplied by SCHENEIDER Company in China. The stepping wheel bearings of the mould rack are SKF special designed for wafer baking oven. The pneumatic components are supplied by FESTO. The main drive will be SEW Eurodrive of German brand. There is an automatic spurring-cleaned device at the bottom of the baking oven.There is second pressure relief valve.

Pictures:

Technology:

Main technical parameter:

Baking Plate Size: 470mm x 325mm

Sheet Pattern: 2.5×2.5×0.5 (Standard)