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Specifications

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Technical parameters

Power: 1500W

Voltage: AC110V-220V 50/60HZ

Infrared lamp body power: 300W

Preheating plate power: 1200W

Working bench size: 320*330mm

Infrared lamp body heating size: 60*60mm

Preheating plate size: 245*260mm

Preheating plate temperature range: 0-350°C

Features

1. Eight temperature waves, user can select the right temperature wave according to the solder/unsolder request.

2. Intelligent temperature wave heating, solder/unsolder automatically.

3. Three-dimensional adjustable lamp body, adjustable PCB holder, laser light, suitable for unsoldering all-dimensional components.

4. PID intelligent temperature control can avoid the IC damage due to the fast or uninterrupted heating up.

5. Super hot melt system, use infrared welding technology which was developed independently, 

heat is easy to pierce and distribute evenly, can suit for a variety of computer, notebook, play station’s  BGA components, 

especially in a Northbridge/ Southbridge chipset of computer.

6. Easy operate, perfect LCD display, no need to connect with the PC, can see the whole welding process very clearly.

7. Good build quality, light weight, big working area, easy transportation or storage.

Warranty

Warranty – the main body maintains for one year and the spare parts maintains for three months.

Service – provide the immediate network online Q/A and the technical advisory work service