High performance Seiki hot runner injection nozzle for automotive industry

High performance Seiki hot runner injection nozzle for automotive industry

• Comprehensive specialty manufacturer of runner-less devices

• Advanced technological seeds, extensive track record, and extensive lineup

• Offers resource- and energy-saving systems

Applicable to a wide range of general molded product sizes.
Applicable to multi-cavity molding.
Applicable to general-purpose engineering plastic.

Prevents the occurrence of burnt resin and contamination through minimal resin volume and

first-in, first-out structure.
Tip can be selected and swapped according to resin type.

Uses external heating method for high injection rate.
Optimal application to super engineering plastics.

Multiple tip type with 8, 12, or 16 tips on 1 block body.
Minimum gate pitch (15mm) allows easy multi-cavity molding.

The first tip heater-equipped model with an external heating topless structure.
Applicable to ultra-small mechanical component molding using high-performance resins.
Compact design applicable to multi-cavity molding with minimum pitch of 7mm

Minimum gate pitch of up to 32mm is possible.
Equipped with valve pin stabilizer at tip.
All general-purpose resins, general-purpose engineering plastics (POM, PC, ABS, PA, etc.). 

Applicable to a wide range of molding, from general-purpose resins to general-purpose

engineering plastics.
Addition of (optional) tip heater function enables conditional settings for molding of resin with

filler / crystalline resin (PET preform), etc.

Single cavity direct gate-only, using SVP-type center gate method.
Multiple number can be used in conjunction with manifold.

Compatible with ultra-thin-type. Applicable to a wide range of molding,

from (fixed-side mold thickness 120mm) general-purpose resins to

general-purpose engineering plastics.
Equipped with valve pin stabilizer at tip. Tip heater as standard equipment.

Seiki designs with energy-saving manifolds, and reduces weight with necessary functional parts retained.
Seiki assures uniform temperature distribution.
Seiki performs design / processing without resin residue.

Seiki accepts orders for consolidated design, manufacture, assembly,

and wiring of hot runner peripheral equipment

(mounting plate, spacer block, backplate, and connector box),

with exception of fixed-side cavity plate.
Seiki reduces workload and shortens delivery times for customers through design and

manufacture of the entire hot runner section.

The CE Mark-compliant design is resistant to disturbance noise and does not create radiated

noise.
Electrical closed loop control and power supply voltage correction circuits enable stable

molding even in environments with fluctuating power source voltage. 

Compliant with the EN (unified European) Standards of EMS / EMI,

with design that is resistant to disturbance noise and does not create radiated noise.
Can be connected with confidence to electric molding equipment.

Compact controller specialized for small number of cavities, up to 4 gates.
Fully-featured.
Improved adaptability to harsh usage environments.
RoHS-compliant.