1900 bonding encapsulant for COB

Specifications

                         1900 bonding encapsulant for COB

King Bali 1900 is fixed for bonding electronic components and packing,for metal,ceramics,glass,fiber products andrigid plastic 

encapsulation between bonding,with excellent adhesion strength of this series can be modulated as required 

curing time.

To avoid affecting the heat -conducting and adhesiveness, please make sure that the surface of the component is clean enough and theres no such as dirt, oil or salt on it. . Well mix A in the original container before using for precipitation might appear after long time storage

Weigh A and B exactly according to the specified ratio and then mix them well color difference exist for A and B, please mix them till color difference disappears) . Please use the mixed products in 1-2 hour(s). Over-time using leads viscosity increase. A proper amount is suggested to avoid wasting. . Thicker than 0.15mm application of the products causes lower speed of curing, lower heat conductibility and waste. . The speed of curing might be affected by seasons and temperature. Low speed in winter is possible. Heating to accelerate uring is recommended

Certificate:

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