Dinghua 2 in 1 head design vga bga repair station bga reflow tool DH-390
- shenzhen/Hongkong
- Credit Card
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Product Details
Place of Origin | Guangdong, China | Brand Name | DINGHUA | |
Model Number | DH-390 | Voltage | AC220V±10% / 110V 50/60Hz | |
Current | 20A | Rated Capacity | 3200W | |
Rated Duty Cycle | 100% | Dimensions | approx 560*490*580mm | |
Weight | Approx 32KG | Usage | soldering ,dissoldering chip,rework station for chip repair | |
Certification | CE ISO 9001 2008 ROHS | After-sales Service Provided | Engineers available to service machinery overseas |
Product Description
Dinghua 2 in 1 head design vga bga repair station bga reflow tool DH-390
Specification:
Total Power | 4800W / 4350W |
Top heater | 800W |
Bottom heater | 2nd 1200W, 3rd IR heater 2700W |
Digital Iron power | 80W |
Power | AC220V±10% 50Hz |
Top head | Two top heads: hot air and infrared, easy replacement. |
Top hot air speed | Can be adjusted by adjusting knob, prevent tiny bga from movement when heating. |
Cleaning tin | With digital soldering iron, for rapid clean residual tin after desoldering, prevent pcb and bga from oxidize |
Top heater movement | Right/left, frontward/backward, rotate freely. |
Lighting | Double shadowless LED lights, any angle adjusted freely |
Operation mode | Digital panel meter |
Storage | 10 groups of temperature profiles. |
Positioning | Intelligent positioning, PCB can be adjusted in X, Y direction with “5 points support” + V-groov pcb bracket + universal fixtures. |
Temperature control | K sensor, close loop |
Temp accuracy | ±2℃ |
PCB size | Max 390×370 mm Min 22×22 mm |
BGA chip | 2x2 - 80x80 mm |
Minimum chip spacing | 0.15mm |
External temper sensor | 1pc |
Dimensions | L560×W490×H580 mm |
Net weight | 32KG |
FAQ:
Why bga can't solder on pcb?
There are two factors:
1. if Part of it can't solder, most likely that bga do not align with pcb perfectly.
2. if whole one can't solder, it is because heating temperature too low for it, you will need to raise temperature or prolong heating time.
What cause bubble on bga or pcb?
1, Moisture on pcb and bga will cause bubble when heating, so dry them with oven before soldering / desoldering.
2, Temperature too high for them. Lower temperature or shorten heating time.
Can solder ball reuse?
Solder balls should not be used again once they touch flux. Because they will easily stick together once touch
flux.
What is melting point of solder balls?
Lead solder ball: 180℃ - 185℃
Lead-free solder ball: 210℃ - 230℃
About our:
Certifacation:
Our service:
Customization: We provide OEM services.
Warranty: 1 year for the whole machine and 3 years for the heating wire.
Oversea engineer available to service machinery overseas
Why choose Dinghua?
1, Well-equipped manufacturing facility.
2,Professionalism innovative R&D team, provide professional service for bga rework station solution.
3,Optimum performance,precision temperature control to ensure high rate of success for S&M. As we know, the performance of bga chip soldering and desoldering highly depends on the precise of the temperature. Our bga machine use PID control,the data acquisition frequency of our machine is 10ms(which means every 10ms the PID will grab the data to correcting the temperature), but among the bga rework station industry, most of company just use the PID grab freqency is 30ms.
4,International quality standard range,all our product have got the CE, ISO9001,ROHS approval.
5,Competitive price. All our machine material select from world class brand (like Omega,SMC,CNB,GS, which ensure safety,convenient speedily operation.
6,Customized packaging and Fast delivery via Fedex, DHL, UPS, EMS, TNT and so on. Generally goods can be ready in 7 days after the receipt of the payment.
7,We supply 1 year warranty for this BGA rework station , in the first year, offer spare parts for free, and the heating colil is for three year warranty. Life long technical support.
Contact Us
- Shenzhen Dinghua Technology Development Co., Ltd.
- Contact nameLi Chat Now
- Phone86-755-29091822
- Addressxinqiao, Shenzhen, Guangdong
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