Gold Finger TG170 Cheap Printed Circuit Board

Items

Mass

Prototypes

Layers

1-8 Layers

1-20 Layers

Max. Panel Size

600*770mm( 23.62"*30.31")

600*770mm(23.62"*30.31") 500*1200mm(19.69"*47.24")

Max.Board Thickness

8.5mm

8.5mm

Min. Board Thickness

2L:0.3mm

2L:0.2mm

4L:0.4mm

4L:0.4mm

6L:0.8mm

6L:0.6mm

Min Inner Layer Clearance

0.1mm(4mil)

0.1mm(4mil)

Min Line width

0.1mm(4/4 mil)

0.075mm(3/3 mil)

Min Line space

0.1mm(4/4 mil)

0.075mm(3/3 mil)

Min.Hole Size

0.2mm(8mil)

0.15mm(6mil)

Min plated hole thickness

20um(0.8mil)

20um(0.8mil)

Min Blind/Buried hole size

0.2mm(8mil)

0.2mm(1-8layers)(8mil)

PTH Dia. Tolerance

±0.076mm(±3mil)

±0.076mm(±3mil)

Non PTH Dia. Tolerance

±0.05mm(±2mil)

±0.05mm(±2mil)

Hole Position Deviation

±0.05mm(±2mil)

±0.05mm(±2mil)

Heavy Coppe

4OZ/140μm

6OZ/175μm

Min S/M Pitch

0.1mm (4mil)

0.1mm (4mil)

Soldermask colour

Green,black,Blue,White,Yellow,Red

Green,black,Blue,White,Yellow,Red

Silkscreen colour

White,Yellow,Red,Black

White,Yellow,Red,Black

Outline

Routing,V-Groove, Beveling punch

Routing,V-Groove, Beveling punch

Outline Tolerance

±0.15mm ±6mil

±0.15mm (±6mil)

Peelable mask

Top,bottom,double sided

Top,bottom,double sided

Controlled Impedance

+/- 10%

+/- 7%

Insulation Resistance

1×1012Ω(Normal)

1×1012Ω(Normal)

Through Hole Resistance

<300Ω(Normal)

<300Ω(Normal)

Thermal Shock

3×10sec@288℃

3×10sec@288℃

Warp and Twist

≤0.7%

≤0.7%

Electric Strength

>1.3KV/mm

>1.4KV/mm

Peel Strength

1.4N/mm

1.4N/mm

Solder Mask Abrasion

>6H

>6H

Flammability

94V-0

94V-0

Test Voltage

50-330V

50-330V

Benefits for customer

*- Get a high quality product. *- Get a lower price of product to occupy the market from our online order *- Our one stop service release your energy to focus on design and marketing. *- Get a strategic long term partner.

Our Service:

*- Comprehensive documents audit to prevent mistakes in PCB Gerber and Bom.

*- Suggest best quality replacement with lower price.

*- Engineering support for test and provide suggestions for mass production.

*- Suggest best shipment method.