Shenzhen electronic product assembly service

Specification

Process capability

Type

Single-sided, double-sided, multi-layer

Materials

FR-4, CEM-1, CEM-3, high-frequency halogen-free, aluminum, iron base, copper base

Finish Board Thickness

0.2mm-6.0mm

Copper substrate thickness

18um,35um,70um,105um

Surface

Hasl(LF), Electroless nickel gold, spray tin, chemical gold, carbon oil, gold finger, OSP, 

immersion tin, immersion silver, OSP(Entek)

Maximum size

600mm*700mm

Solder Mask

Green, Black, Blue, White, Red, Yellow

Board Warp

Single-Sided≤1.0% Double-Sided ≤0.70%plywood≤0.50%

The minimum thickness & Tolerance

0.2mm±0.08mm

Minimum line width / line Gap & Tolerance

Spray tin plate:0.1mm±20%(4mil±20%)

Gold Plate:0.076±20%(3mil±20%)

Copper from the Edge

0.5mm(20mil)

Hole margin line edge

0.3mm(12mil)

Minimum aperture & Tolerance

0.2mm±0.076mm(16mil±3mil)

Minimum Pitch & Tolerance

0.4mm±0.076mm(16mil±3mil)

Hole copper thickness

20-25um(0.79mil-1.0mil)

Positioning hole deviation

±0.076mm(±3mil)

Chong Min hole diameter

FR-4 Board Thickness 1.0mm (40mil) the following:1.0mm(40mil)

FR-4 Board Thickness 1.2-3.0mm(48-120mil):1.5mm(60mil)

Min Chong Fang slot specifications

FR-4CEM-3 Board Thickness 1.0mm(40mil) :0.8mm*0.8mm(32mil*32mil)

FR-4 Board Thickness 1.2-3.0mm(48-120mil):1.0mm*1.0mm(40mil*40mil)

Screen Printing Line bias

±0.076(±3mil)

Min pad window

0.076mm(±3mil)

Minimum green oil Bridge

±0.76mm(±3mil)