mini wafer machine

1.Features of mini wafer machine :

     Wafer machine can make many wafers with various designs and different layers. The cutter machine can cut the wafer into different rectangular according to your requirements.

2.Processing flow of mini wafer machine

   Planetary Mixer→Wafer Machine→Cream spreading machine→Wafer Cutter

3. mini wafer machine introduction as follows

  1) Wafer machine

      Before you operation, you need to turn it on for 35 minutes preheating. After that, you pour the wafer raw material onto to bake and tread clutch pedal. Then you repeat this step to make another. Each cycle can make 9 pieces and it takes 3 minutes. The baked wafer piece was removed out by flat shovel.

         2) Cutter machine

        Before you operation, you need to adjust the wafer size according to your requirement. Than the creamed wafer plates were push into the cutter machine and were cut into wafer biscuits. One set wafer cutter can match with four sets wafer machine to work at the same time.

4.samples of mini wafer machine :

5.Loading and shipment of wafer machines:

6.Customer with us:

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