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High quanlity Lead Free Solder paste YGS 0307 Quality Choice
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Product Details
| Place of Origin | Zhejiang, China | Brand Name | SSTS | |
| Model Number | YGS 0307 |
Product Description
Specifications
Lead free Tin Solder YGS0307Best conductivity & solder bility
Mid temperature solder
Contain rosin flux & tin powder
Specifications
Lead Free tinning paste YGS 0307
Best conductivity & solderbility
Mid temperature solder
Contain rosin flux & tin powde
China soldering factory tinning paste YGS 0307 for electronics Sn99 Ag0.3 Cu0.7
Description of tinning paste YGS Sn63/Pb37
Sn99 Ag0.3 Cu0.7 no clean solder paste was developed to meet the demands of tin lead soldering when lead free components are present in the circuit assembly. Sn99 Ag0.3 Cu0.7 solder cream has excellent print volume repeatability to minimize variation in the print process. Sn99 Ag0.3 Cu0.7 minimizes print cyle times through high print speeds and extended number of prints between stencil under cleaning.
Model | YGS 3005 | YGS 0307 | YGS 58L | YGS 35L | YGS 6337 |
Alloy Composition
| Sn96.5Ag3.0Cu0.5 |
Sn99Ag0.3Cu0.7 |
Sn42Bi58 |
Sn64Bi35Ag1 | Sn63Pb37 |
Melting Point | 217°C | 219°C | 138°C | 139°C | 183°C |
Powder Specification | 25-45mm | 25-45mm | 25-45mm | 25-45mm | 20-38mm |
Flux Content |
9.0%-9.5% |
9.0%-9.5% |
9.0%-9.5% |
9.0%-9.5% | 9.0%-9.5% |
Viscosity |
190pa.s-210pa.s |
190pa.s-210pa.s |
190pa.s-210pa.s |
190pa.s-210pa.s | 190pa.s-210pa.s |
Powder size:
| MESH SIZE | MICRONS SIZE | Particular type |
| -200+325 | 75-45μm | 2 |
| -325+500 | 45-25μm | 3 |
| -400+635 | 38-20μm | 4 |
| -500 | 25-15μm | 5 |
| -635 | 15-3μm | 6/7 |
Sn99 Ag0.3 Cu0.7 is also a zero halogen product with very low halogens intentionally added to the formulation. We are also can supply 100g per syringe packing solder paste,which need to use reflowing machines for spot welding technique.
Feature of tinning paste 6337
2.It is an organic acid, water-soluble solder paste that provides users with the highest level of consistency and performance.
3.Batch after batch, it provides hours of stable stencil life, tack time and repeatable brick definition.
Availability:
is recommended, but different powder particle size distributions are available for standard and fine pitch
applications. For specific packaging information see our Solder Paste Packaging Chart for available
sizes. The appropriate combination depends on process variables and the specific application.
Printing Parameters:
Squeegee Blade
Squeegee Speed
Stencil Material
Temperature/Humidity
80 to 90 durometer polyurethane or stainless steel
Capable to a maximum speed of 150 mm/sec (6 in/sec)
Stainless Steel, Molybdenum, Nickel Plated, Brass
Optimal ranges are 21-25°C (70-77°F) and 30-70% RH
Storage, Handling, and Shelf Life
Refrigeration is the recommended optimum storage condition for solderpaste to maintain consistent viscosity,
reflow characteristics and overall performance. paste should be stabilized at room temperature prior to
printing. It should be kept at standard refrigeration conditions, 0-10°C (32-50°F). Please contact us if you require additional advice with regard storage and handling of this material. Shelf life is 6 months
from date of manufacture when handled properly and held at 0-10°C (32-50°F).
Health & Safety
This product, during handling or use, may be hazardous to health or the environment. Read the Material Safety Data Sheet and warning label before using this product.
Contact Us
- Ningbo Silver Sheep Tin Solder Co., Ltd.
- Contact nameyanli xu Chat Now
- Phone0086-574-87883480
- AddressIndustry Zone ,Xianxiang ,Yinzhou,Ningbo,China , Ningbo, Zhejiang
Product Categories
| Brass Rod | Electronic Components | New Products | Silver Brazing |
| Solder Accessory | Solder Machine & Tools | Solder Paste | Tin Lead Solder Wire & Bar |
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