High quality low price WNiFe.WNiCu Tungsten alloy sheet/Heat sink sheet for Encapsulation Electronics packages etc...

1.Used as high temperature resistance in electronic products and Auto-Engines. Like Computer generates vast amounts of heat, which results in the slow of speed.Tungsten alloy heat sink can solve this problem. 

2.Used in applications such as optoelectronics packages, Microwave Packages, Packages, Laser Submounts, etc.

3.Used as heat sink pieces and encapsulation shell.

4.Used in thermal mounting plates, chip carriers, flanges, and frames for RF, microwave millimeter wave packages like LDMOS FET; MSFET; HBT; Bipolar; HEMT; MMIC, light emitting diodes and detectors, laser diode packages like pulse, CW, single emitter, bars and complex carriers for optoelectronics amplifiers, receivers, transmitters, tunable Lasers.

Quick Response:feedback within 24hours
High quality:Well-trained workers and more than 10 years experience technical staff
Competitive price :Directly from factory to save your money.
short lead time:sample 5-10days,large order about 20 days
Flexibility:order no matter how big or small all welcome
OEM & ODM both ok

We can offer various type with different functions for customers, not only manufacture

according to the international standard, but also can design as per the requirements of customers.

 Please choose freely from the wide range of already available WNiFe.WNiCu Tungsten alloy sheet/Heat sink sheet for Encapsulation Electronics packages etc...
or contact us with your specifications. Please do not hesitate to contact Irene.

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