Lasing diode/MCM/CPU components tungsten copper heat sinks

Applications

 As a copper tungsten material, it’s a composite. So both the thermal advantages of copper and the very low expansion characteristics of tungsten can be utilized.
The combination of these two materials results in thermal expansion characteristics similar to those of silicone carbide, aluminum oxide, and beryllium oxide, used as chips and substrates.
Tungsten copper heat sinks are extensively used in thermal mounting plates, chip carriers, flanges, and frames for RF, microwave millimeter wave packages like LDMOS FET; MSFET; HBT; Bipolar; HEMT; MMIC, light emitting diodes and detectors, laser diode packages like pulse, CW, single emitter, bars and complex carriers for optoelectronics amplifiers, receivers, transmitters, tunable 

Service we can off you 

1.Quick Response:Your inquiry will be replied within 24 hours.

2.High Quality:Well-trained workers and more than 15 years experience.

3.Competitive Price:Directly from factory to save your money.

4.Short Lead Time:Being efficient:3-5 days for samples and 10-20 days for      quantity orders.

5.Flexibility:Small orders are acceptable for quick delivery and to help you     reduce stock cost.

6.OEM&ODM:Custom fabrication according to your drawings ,samples or          designs. 

We can offer various type with different functions for customers, not only manufacture according to the international standard, but also can design as per the requirements of customers.

Please choose freely from the wide range of already available Lasing diode/MCM/CPU components  tungsten copper heat sinks  or contact us with your specifications.

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