Home > Products > SOLDERLESS BREADBOARD > 1660 Tie-point Solderless Breadboard test prototype board TCB-204
1660 Tie-point Solderless Breadboard test prototype board TCB-204
US$ 0.1 - 10
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Product Details
| Model Number | TCB-204 | Type | Other | |
| Brand Name | INTEC | Place of Origin | Zhejiang, China |
Product Description
1660 Tie-point Solderless Breadboard
SPECIFICATIONS
Contact Resistance: 100mΩmax
Insulator Resistance: 1000Mωmin.@DC 500V
Dielectric withstanding Voltage:AC 500V For 1 minute
Operating Temperature: -20°C–+80°C
Housing Material: ABS
Contact Material: Copper alloy nickel plated
Contact way: Spring clip
Connector Type: Socket
Recycle use
aluminium base board
Socket metal:phosphor bronze/beryllium copper for choice
Terminal Strip:2×630
Distribution Strip:4×100
Binding Post:3
Plug times: ≥10000 times
Housing size( L*W*H)
23cm*13cm*0.835cm
pitch=2.54mm / 0.1''
all material Rohs compliance
Contact Us
- Cixi Intec Import And Export Co., Ltd.
- Contact nameMichael GAO Chat Now
- Phone86-180-5827 6507
- AddressNO.188 DAFA ROAD, CIXI, ZHEJIANG, P.R.CHINA, Ningbo, Zhejiang
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