Adhesive for metal, IC, electronic components

Type

Name

Basic 

composition

Performance test

Basic

Application

Special

Function

HYJ-45 

Epoxy Adhesive

Epoxy resin

 Shear strength test:

Room temperature

≥4MPa,-60℃≥2Mpa

Apply to bonding of 

Metal(Steel,stainless 

steel,Aluminum Alloy) 

and Nonmetal(celluloid)

Using Temperature -60 - 60℃ 

HYJ-51

The adhesive of 

heat conduction 

and insulation 

Room and Middle 

temperature Heat 

curing

Epoxy resin

Shear strength test:

Aluminum-Aluminum 

40℃≥15MPa 

room temperature≥18Mpa,

150℃≥5MPa 

200℃≥2MPa 

Heat conductivity:0.8-1.0W/m.K 

Surface Resistance≥1.2×1016Ω

Volume resistance≥5.0× 1014Ωcm 

breakdown voltage≥20 kv/mm 

Special Adhesive of all 

kinds of Wall temperature 

sensor.

Room or middle temperature 

curing,Heat conductive and 

insulatingGood waterproof 

performance.

GXJ-35

silicone rubber 

adhesive

Organic 

silicon 

rubber

Peel strength:

glass cloth-glass cloth >0.02 MPa,

tensile strength> 0.7MPa 

Could be used as Surface 

moisture-proof coating.

Apply for moisture-proof bonding of 

metal and nonmetal.

Room Temperature curing,

Excellent ablating performance,

Apply to heat resistance and seal.

GXJ-36

silicone rubber 

adhesive

Organic 

silicon 

rubber

 Shear strength test:

Aluminum-Aluminum 

Room Temperature>2 MPa 

 Apply for heat sealing 

bonding of metal and 

nonmetal.

Room Temperature curing,

Excellent ablating performance,

Apply to heat resistance and seal.

 GXJ-39

Conductive 

silicone 

rubber

Organic 

silicon 

rubber

Shear strength test:

Aluminum-Aluminum 

Room Temperature>1 MPa 

Resistance 

value<10 -2Ω.cm 

 To bond the electronic 

components

Excellent Conductive performance

Good toughness,Room temperature 

fast curing,Excellent ablating 

performance.  

Dq441J

Conductive 

adhesive

Organic 

silicon 

rubber

Shear strength test:

Aluminum-Aluminum 

≥1.0MPa Volume resistance≤0.1Ω.cm 

Apply to the bonding of 

metal and nonmetal,etc.,

Room temperature ,curing,

Excellent bonding resistance,

Good conductive performance.

Dq442J-86

Multi-function 

suit

Organic 

silicon 

rubber

Shear strength test:

-40℃- 200℃≥1.0MPa Tensile strength

>2.0MPa heat conductivity≤0.15W/m.K 

Density≤0.6g/cm2

Apply to the bonding of 

metal and nonmetal,etc.,

Excellent Heat conductive 

performance

DWJ-72 

ultralow 

temperature

Heat conductive 

and insulating 

adhesive

PU

Shear strength test:

aluminium alloy

Room temperature≥8.0MPa.

-196℃≥8.0MPa 

heat conductivity>0.45W/m.K

To bond the ultralow 

temperature Heat conductive 

and insulating parts.

Perfect low temperature 

resistance,Heat conductive 

and insulating