ZM-R380B BGA Reball Machine

1,Standard Wooden Case/Carton
2,Dimensions is L445*W430*H500mm
3,GW:25KG

Specifications

ZM-R380B BGA Reball Machine

1. Main Features:

1. Easy to operate,mainly repair chips of Laptop/mobile/ps2/ps3 etc.
2. The bottom is IR heater, The top is hot-air heater,mounting,welding&dewelding process are stable and accurate
3.  The top heater’s highest temperature can reach to 400 degree.and temperature controller save 10 groups of temperature parametres and can be setted 8 segments heating control and 8 segments constant control.
4. Imported high-precision materials (temperature sensor, PLC, heater) tocontrol the BGA desoldering & soldering procedures precisely.
5. This machine has a computer communications function, built-in PC serial port, external temperature interface with software to achieve computer control.
6. Upper and lower temperature area independent temperature measurement.High-precision thermocouple to achieve the precise temperature detection.
7. The top and bottom heaters work independently. A cross-flow fan make the PCB cool prevent deformation when welding.
8. Equipped with a V type groove and flexible fixture used to firmly fiX PCB
9. For large thermal capacity of PCB or other high-temperature and lead-free welding requirements, all can be handled easily.
10. With hot-air flow adjust device,control the hot-air speed to meet and ensure  the welding effect of BGA/VGA/CBGA/CSP.
11. It has alarming after welding. 
12. CE idendificated,ensure the product value and 1 year warranty,(offer free parts within 1 year) 

2. Specifications:

3. Packing List: