BGA Rework System

Specifications

1. Excellent heating material produces high temperature breeze, precise control of BGA
desoldering and welding process

2. Adjust hot air flow and temperature greatly, produce high-temperature breeze;

3. Movable heating head, able to move horizontally, easy to operate;

4. The temperatures of the upper and lower heater can be precisely controlled
according to set temperatures; bottom constant temperature infrared heating area;
appropriate temperature control apparatus can ensure safe rework for BGA

5. Touch screen interface, PLC control; real-time temperature profile display, able to
display set profile andpractically-testedprofile

6. Powerful cross flow can cool the lower heating arearapidly;

7. Equipped with different hot gas nozzles, easy to replace; can be customized
according tospecific needs;

8. The adjustable PCB positioning supports, easy and fast to install PCB; special fixture
forinstalling irregularboards ;

9. The BGA soldering supporting frame can micro-adjusted to avoid local sinkage

10. 6 segments of temperature up(down) and 6 segments constant temperature control, profile saving is unlimited in the industrial computer, profile analysis can be carried out on the touch screen

11. Equippedwith over temperature alarming and protection functionboth upper and lower heating area
with sound alarming function after finishing soldering or desoldering; hand vacuum
pen easyfor picking up BGA

12. The integrated design of machine and chassis is room-saving,and the machine can be
changed for their instrumentation control according to the need.