ENIG Rigid Flex Circuit fabrication, rigid-flex pcb

FOB Price

Negotiable / Piece

5 Pieces(Min. Order)

Port shenzhen HK
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Product Details

Place of Origin	Guangdong, China	Brand Name	OEM
Base Material	polyimide & PI	Copper Thickness	1oz
Board Thickness	1.0mm	Min. Hole Size	3mil
Min. Line Width	3mil	Min. Line Spacing	3mil
Surface Finishing	Immersion gold, Lead free HAL

Product Description

Specifications

ENIG Rigid Flex Circuit fabrication
Efficient Quotation,Strict Production,Reliable Quality
Approval: UL,ISO9001
Fast Delivery

Your Best Choice for Flex PCB and Rigid-Flex PCB Manufacturing & Assembly

ENIG Rigid Flex Circuit fabrication

1. Material Combination Polyimide & FR4

2. PCB have solid Rigid Areas and Flex areas with reduced Layer Count

3. Improves design freedom

4. Used in Automotive, Camera systems back & Front, Rain Sensors, Sensors.

ADVANTAGES:

We provide small and medium-volume Rigid-Flex PCB production, can make up to 10 layers Rigid-Flex Circuit Boards. Rigid-Flex PCB line width / spacing can be achieved minimum 3mil, we also provide Rigid-Flex Circuit Boards with HDI, Impedance Control.

TECHNICAL DATA:

Capabilities	Standard Production	Advanced Production
Layer Count / Technology	2 layer - 10 Layer	2 layer - 12 Layer
PCB Thickness Range	75µm - 1600µm	50µm - 2000µm
Materials	Polyimide / FR4	Polyimide / FR4
Thinnest Core	50µm without adhesive	25µm without adhesive
Copper thickness	9µm / 12µm / 18µm / 35µm	9µm / 12µm / 18µm / 35µm
Copper Plating Holes	20µm (25µm)	13µm / 20µm / 25µm
Min. Line / Spacing	125µm / 125µm	65µm / 65µm ( LDI )
Soldermask Registration	+/- 100µm (Photoimageable)	+/- 50µm (Photoimageable)
Min. Soldermask Dam	100µm	65µm
Soldermask Color	amber (green)	amber (green)
Cover Layer Polyimide	laser cutting / punching / drilled	laser cutting / punching / drilled
Production Panel	609,6 mm x 457,2 mm 250 mm x (250 - 410 mm)	609,6 mm x 457,2 mm 250 mm x (250 - 410 mm)
Min. Annular Ring	150µm	150µm
smallest drill	0,28 mm	0,2 mm
smalles Routing bit	0,8 mm	0,8 mm
Surfaces	OSP / Immersion Tin Immersion Ni/Au Plated Ni/Au	OSP/ Immersion Tin Immersion Ni/Au Plated Ni/Au
ID print	White	White
Adhesive Tape	Yes	Yes
SMT Service	Yes	Yes
Stiffner material	FR4,PI	FR4,PI

LEAD TIME FOR PRODUCTION ORDERS:

	Sample Lead time	Mass production lead time
Single sided PCB	1~3	4~7
Double sided PCB	2~5	7~10
Multilayer PCB	7~8	10~15
PCB and Assembly	8~15	15~20

QUOTE REQUIREMENTS FOR PCB AND PCB ASSEMBLY:
- Gerber File and Bom List;
- Quantity;
- Technical requirements for quoting reference;
- Clear pictures of PCB or PCB Assembly sample if avaliable.
- Inspection method for PCB Assembly.

Contact Us

Shenzhen Fulltronics Technology Co., Ltd.: Contact nameJasen Ho
Chat Now; Phone86-755-83975258; Address31C,Block 2,DuShiYangGuang Building,No.6017,ShenNan Rd,Futian,Shenzhen,China, Shenzhen, Guangdong

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Product Categories

Flexible PCB	LED Aluminium Base PCB	Multi-layer PCB	New Products
PCB Assembly	Rigid PCB	Rigid-Flex PCB

ENIG Rigid Flex Circuit fabrication, rigid-flex pcb

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