Lapping Metalized 95% Alumina Ceramic Substrate

Specifications

Introduction:

 It is a high temperature (1650deg C) co-sintered ceramic heater that is made by printing

a metal resistor on a sheet of alumina ceramic.

Advantages:

1.       simple structure

2.       Heating up fast. within 10 seconds, can reach to 100°C-230°C;30s can 500°C-700°C

3.       High thermal efficiency, energy saving with no pollution. Meet Rohs requirement.

4.       Even heating ,no flame ,and use safely

5.       Longlife

Physical properties

1Density: ≥3.6g/cm³  

2.Bending Strength: ≥ 270MPa

3Compression Strength: 2700MPa

4Tensile Force: 180°C direction from leads: ≥5kgf

             90°C direction from leads: ≥3.5kgf

Temperature Property

1.Working Temperature:100°C-230°C

2.Max Temperature: 500°C-700°C

3.Heating Rate: within 30sec., can reach to working temperature; within 90 sec. can reach to max temperature.

Regular thickness:

0.25mm,0.28mm,0.45mm,0.5mm,0.635mm,1.0mm,1.5mm,  1.8mm, 2.0mm

Metallization:

The surface can be covered a lay of metallization,such as Ag, Pd-Ag,Mo-Mn, Ni-plating with good tensile strength:

Mo-Mn thickness: 25~40μm,Ni thickness:3~7μm, Tensile strength≥120MPa

Metallization Materials:

Ceramic + Mo/Mn Metallized + plating Ni
Ceramic + Mo/Mn Metallized + plating Ag
Ceramic + Mo/Mn Metallized + plating Au
Ceramic + printing Ag

Application: 

widely used in thick film circuits large-scale integrated circuits, hybrid ic, semiconductor packages, chip resistors,

networks resistor , focusing potentiometer, power modules, power hybrid circuits and other related fields of electronic

 industry