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Inquiry about 12 - inch Fused Silica Wafers Processing
Posted at: 2025-06-12 12:57
South Korea
RFQ Information
Inquire whether the company is capable of processing 12 - inch wafers with the following specifications: (Materials: fused silica provided by us) φ6, Thickness = 0.625mm±0.02mm; φ8, Thickness = 0.725mm±0.02mm; φ12, Thickness = 1.200mm±0.02mm; Polishing: Ra ≦ 1 nm; Notch Type; TTV (Total Thickness Variation): ≤10 μm; Surface Finish: Double Side Polished. Request confirmation of processing capability and get a quotation for 100 pcs of the above - spec wafers.
| Product Name | Quantity | Target Price | Payment Terms |
|---|---|---|---|
| 12 - inch Fused Silica Wafers Processing | Not specified | -- | -- |
Viewed Records
| Company Name | Business Type | Location | Time Viewed |
|---|---|---|---|
|
XiA******Ltd 
|
Trading Company | Xi'an, Shaanxi, China | 2025-06-12 18:03 |
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